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Bare chip mounting - List of Manufacturers, Suppliers, Companies and Products

Bare chip mounting Product List

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Bear chip implementation

Bear chip implementation

Consistent production from circuit board design to bare chip mounting! Abundant experience with high-difficulty projects.

We provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing

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ベアチップ実装＜高難度案件に対応＞

ベアチップ実装＜高難度案件に対応＞

豊富な実績で構想段階からご対応！車載、ハイブリッドIC、液晶ディスプレイなどに

当社では、基板設計から「ベアチップ実装」まで一貫生産を 行っております。 ワイヤボンディングをはじめ、フリップチップ、ダイシング といった高難度案件に対応。 微細素子高密度実装試作や高集積化実装、パッケージ開封による 障害解析などの実例がございます。 【サービスメニュー】 ■ワイヤボンディング ■フリップチップ ■ダイシング ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。

  • Circuit board design and manufacturing

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!

We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.

  • Circuit board design and manufacturing

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